In a bid to fortify its position within the global semiconductor industry, the United States has announced a $11 billion programme aimed at advancing domestic research and development (R&D) efforts in chip technology.
Termed the “CHIPS R&D Programme,” this initiative signifies a substantial investment in addressing the ongoing chip shortage crisis while nurturing long-term American competitiveness in this vital sector.
President Biden hailed this landmark investment, affirming, “This historic investment will ensure that the United States remains the global leader in innovation and manufacturing,” in a statement. “By investing in cutting-edge research and development, we can create good-paying jobs, strengthen our national security, and ensure that American technology continues to drive the future.”
The $11 billion programme will be allocated across four primary areas:
- The National Semiconductor Technology Centre (NSTC): This initiative will act as the nucleus of the programme, fostering collaboration among government bodies, industry leaders, academic institutions, and other stakeholders to accelerate chip innovation.
- The National Advanced Packaging Manufacturing Programme (NAPMP): Focused on the development of advanced packaging technologies, this programme addresses a crucial aspect of modern chip design.
- The CHIPS Metrology Programme: This initiative seeks to ensure unfettered access to cutting-edge measurement and testing tools essential for advanced chip production.
- The CHIPS Manufacturing USA Institute: An existing institute, it will receive additional funding to further bolster domestic chip manufacturing efforts.
The CHIPS R&D Programme is part of the larger CHIPS and Science Act, a bipartisan legislation passed in August 2022, allocating a total of $52.7 billion to enhance American semiconductor research, development, and manufacturing.
